Patent · US Expired

Method of manufacturing a copper-nickel-silicon alloy casing

US5675883A · kind A · utility

9Cited by

8References

11Claims

0Family size

Assignee

Diehl GmbH & Co. · DE

Inventors

Norbert Gaag · Achern, DE
Peter Ruchel · Achern, DE

Key dates

Filing date	Apr 26, 1995
Grant date	Oct 14, 1997
Priority date	—
Expiry date	Apr 26, 2015

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49991
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The method permits an alloy with a very high elastic limit with very good conductivity and good cold reformability and differs from the conventional method of manufacturing such alloys by heating to about 950.degree. C. and fairly rapid cooling after a preceding cold rolling operation. An improvement in the properties can be achieved by ageing of the alloy at 300.degree. C. to 600.degree. C. for several hours.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.