Process for the production of molded article with sealed pattern
US5676896A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1996 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | Aug 28, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/5635
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for the production of a molded article having a surface including a sealed pattern by an injection compression molding method, which comprises PA1 placing a substrate (thickness: X (mm)) having a pattern on the front surface thereof in a cavity of a mold with the reverse surface of the substrate in contact with a cavity wall of the mold, injecting a molten thermoplastic resin into a space surrounded by cavity walls and the front surface of the substrate, and thereby forming a resin layer (thickness: Y (mm)) on the front surface of the substrate to form a molded article having the pattern sealed with the resin layer and having a thickness of 1 to 6 mm (=X+Y (mm)), PA1 wherein: PA2 a distance (Z+Y (mm)) of the space in the molded article thickness direction is set to satisfy the following relationships when the substrate is placed in the cavity of the mold, when Y is in the range of 0.3.ltoreq.Y<0.5 mm, {7.5-10Y}(mm).ltoreq.Z.ltoreq.5.0 (mm); when Y is in the range of 0.5.ltoreq.Y<2.0 mm, {3.0-Y}(mm).ltoreq.Z.ltoreq.Y<5.0 (mm); when Y is in the range of 2.0.ltoreq.Y<3.0 mm, {2.0-Y/2}(mm).ltoreq.Z.ltoreq.5.0 (mm); and when Y is in the range of 3.0.ltoreq.Y.ltoreq.5.9 mm, {1.…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.