Heat curable elastomeric compositions
US5677411A · kind A · utility
8Cited by
25References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1996 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | Aug 28, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5415
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Secondary contact adhesion or self-bonding in cured liquid injection molding silicone compositions is reduced by the inclusion in the composition of an inhibitor compound selected from the group consisting of phenyl fluids, titanate esters, and silicate esters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.