Wave soldering process
US5678752A · kind A · utility
10Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1995 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Aug 1, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A liquid flux using water instead of a volatile organic compound as the liquid carrier is used in a wave soldering process. Undesirable formation of solder balls, solder bridges and solder webbing is prevented by using an air knife to direct a vigorous jet of gas at the dielectric substrate in the preheating section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.