Dual etching of ceramic materials with an elevated thin film
US5679267A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1996 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/1843
Abstract
A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A shallow etch stop trench (46) is first ion milled around each ceramic island on the front side and then filled with an etch step material (e.g. parylene 48). An optical coat (e.g transparent metal layer 54, transparent organic layer 56 and conductive metallic layer 58) is elevated above the etch step material by an elevation layer (e.g. polyimide 49). For some applications, it has been experimentally verified that there is no loss, and sometimes a measured increase, in optical efficiency when the optical coating is not planar in topology. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 86) containing a massive array of sensing circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.