Anti-bridging pads for printed circuit boards and interconnecting substrates
US5679929A · kind A · utility
12Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1995 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Jul 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides anti-bridging pad(s) for wave soldering of interconnecting substrates. In particular, the present invention provides interconnecting substrates (e.g. printed circuit board) having anti-bridging pad(s) which substantially conform to trailing pad(s), have geometries and/or placements with respect to trailing pad(s) in an array of functional pads which reduce or eliminate solder bridging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.