Chip resistor and method for producing the same
US5680092A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1994 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Nov 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/075
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high precision chip resistor having a low resistance and a small TCR is obtained. This chip resistor includes an insulating substrate, a resistive layer made of a Cu--Ni alloy formed at least on one face of the insulating substrate, and end face electrodes provided on a pair of end faces of the insulating substrate facing each other so as to be connected to the resistive layer. The resistive layer is formed by heat-treating a plating layer containing Cu and Ni at high temperature. The end face electrodes are formed by metal thin film deposition technique at low temperature. A method for producing the chip resistor is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.