Copper alloy foils for flexible circuits
US5681662A · kind A · utility
5Cited by
24References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1995 |
| Grant date | Oct 28, 1997 |
| Priority date | — |
| Expiry date | Sep 15, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit to interconnect two components of an electrical device is formed with a flexible polymeric substrate. A copper alloy is laminated to the flexible substrate. This copper alloy is processed to have relatively high strength, an ultimate tensile strength in excess of about 80 ksi, by either alloying additions, by processing or by a combination of the two. When such an alloy is laminated to the polymeric substrate, the resultant flexible circuit has improved (more cycles to failure) dynamic fatigue performance when compared to both pure copper and dilute copper alloys.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.