Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
US5681757A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1996 |
| Grant date | Oct 28, 1997 |
| Priority date | — |
| Expiry date | Apr 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to the process of die bonding semiconductor integrated circuit microchips with adhesive deposited from microjets in a precise pattern. Print-head technology equivalent to that used in inkjet printers is used to apply the adhesive substance (most commonly an epoxy). The use of microjets in an "array printhead" to deposit an adhesive pattern provides advantages in the ability to control the location and size of the adhesive droplets with a high degree of precision. The method also provides for individual actuation of the microjets providing the ability to rapidly change from pattern to pattern without the need to change and clean heads and equipment or to provide multiple heads. The method has application in standard die bonding as well as "flip-chip" processes using "bumped dies." The high degree of precision available allows adhesive to be printed in between the solder bumps of a "bumped die" providing stronger bonding and an underfill without interfering with the electrical connection created by the solder bumps. Also disclosed is a novel method for accomplishing a "flip-chip" process in which the array printhead is used to print conductive epoxy dire…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.