Polyetherketone resin compositions and carries for processing and treating semiconductor wafers
US5681888A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1996 |
| Grant date | Oct 28, 1997 |
| Priority date | — |
| Expiry date | Jan 19, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyetherketone resin composition comprising 5-100 parts by weight of a carbon fiber having an average fiber diameter of 5-20 .mu.m and an average fiber length of 30-500 .mu.m per 100 parts by weight of a composition comprising 95-50% by weight of a polyetherketone and 5-50% by weight of a liquid crystal polyester, and a carrier for processing or treating a semi-conductor wafer molded from the above polyetherketone resin composition. Said composition is excellent in molding properties and said carrier is excellent in stiffness, dimensional stability and antistatic properties. The above liquid crystal polyester includes, for example, those consisting of repeating structural units (I), (II), (III) and (IV), shown below, in a molar ratio (II)/(I) of 0.2-1.0, a molar ratio (III)+(IV)!/(II) of 0.9-1.1 and a molar ratio (IV)/(III) of 0-1.0. ##STR1##
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.