Heat exchanger for cooling semi-conductor elements or the like
US5682948A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 20, 1996 |
| Grant date | Nov 4, 1997 |
| Priority date | — |
| Expiry date | Feb 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat exchanger for cooling semi-conductor elements or such equipment, in particular high capacity cooling unit of extruded aluminum or another light weight metal, featuring cooling fins that are connected to a base plate, are spaced apart from each other and are each in the form of a hollow section with two parallel fin walls connected by transverse struts, where the cooling fin is secured in a groove or like recess in the base plate. A free groove is provided beside each occupied groove in the base plate 14 of the heat exchanger and accommodates a counter-lying cooling fin of a second heat exchanger into the base plate of which the cooling fins of the first heat exchanger engage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.