Process of producing aluminum nitride multiple-layer circuit board
US5683529A · kind A · utility
6Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1996 |
| Grant date | Nov 4, 1997 |
| Priority date | — |
| Expiry date | Jun 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process of producing a multiple-layer circuit board of aluminum nitride, including the steps of: preparing green sheets of aluminum nitride, forming on the green sheets conductor patterns of a conductor paste containing tungsten as a main conductor component, laminating the green sheets with the conductor patterns formed thereon to form a lamination, and firing the lamination in a container made of boron nitride and in a pressurized nitrogen gas atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.