Method of forming vias
US5683758A · kind A · utility
9Cited by
18References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1995 |
| Grant date | Nov 4, 1997 |
| Priority date | — |
| Expiry date | Dec 18, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.