Liquid-phase diffusion bonding alloy foils for joining heat-resistant metals in oxidizing atmospheres
US5683822A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1996 |
| Grant date | Nov 4, 1997 |
| Priority date | — |
| Expiry date | Sep 27, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, plus 0.005 to 1.0 percent carbon, and/or either or both of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, with the balance comprising nickel and impurities, and have a thickness of 3.0 to 300 .mu.m. Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere are also available with substantially vitreous structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.