Thin film wiring board
US5686191A · kind A · utility
5Cited by
1References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 7, 1995 |
| Grant date | Nov 11, 1997 |
| Priority date | — |
| Expiry date | Nov 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.