Semiconductor device having integral structure of case and external connection terminals
US5686758A · kind A · utility
24Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1995 |
| Grant date | Nov 11, 1997 |
| Priority date | — |
| Expiry date | May 16, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.