Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen
US5688364A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 19, 1995 |
| Grant date | Nov 18, 1997 |
| Priority date | — |
| Expiry date | Dec 19, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a chemical-mechanical polishing method and apparatus ensuring excellent polishing rate and flattening characteristics for flattening level different areas on interlayer insulating film generated in the manufacturing process of a semiconductor device. Polishing is performed while ultrasonic wave vibration is being applied to a processing substrate. The ultrasonic wave vibration applying means are mounted on the carrier and platen. Thereby, since polishing is performed while using the ultrasonic wave energy in addition to the conventional chemical-mechanical polishing method, polishing rate can be much improved. Moreover, since the slurry is supplied sufficiently without relation to pattern density and areas of the level different areas, uniform and flat surface not depending on the pattern can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.