Microbolometer
US5688699A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1996 |
| Grant date | Nov 18, 1997 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is provided for forming a bolometer having an infrared sensitive material disposed on a platform elevated over a surface of a semiconductor body. The method includes forming a thermally insulating support layer to provide the platform and legs for supporting the platform over the semiconductor body. A layer of electrically conductive material is formed over the support layer and onto electrical contacts of an electronic circuit formed in the semiconductor body. The layer of electrically conductive material is patterned into electrical conductors passing, at a proximal end thereof, from the contact region of the electronic circuit upwardly to, at the distal end thereof, the platform region. The patterned electrically conductive layer is used as a mask for selectively removing portions of the support layer exposed by the patterned electrically conductive layer while portions of the support layer remain disposed under such patterned electrically layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.