Method for protecting electronic circuit components
US5689878A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1996 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Apr 17, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.