Process and soldering paste for soldering on large-area plates of aluminum or aluminum alloys and use of that process
US5690271A · kind A · utility
9Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 17, 1996 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Jun 17, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a process for soldering on large-area plates of aluminum or aluminum alloys on to a workpiece comprising an iron-base alloy, use is made of a soldering paste comprising a flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder on a polymethacrylate base. In addition the respective proportions of the flux are between 40 and 60% by weight, the solder powder between 60 and 40% by weight and the binder between 0.2 and 2% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.