Method for the manufacture of a contact-free or hybrid card
US5690773A · kind A · utility
130Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1995 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Feb 22, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, a frame is deposited on a lower thermoplastic sheet demarcating the edges of a cavity; the electronic module is positioned at the bottom of the cavity; this cavity is filled with a polymerizable resin; and the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied. The resin polymerizes, and the card is cut out within the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.