Method of producing cavity structures
US5690841A · kind A · utility
94Cited by
9References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1996 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Jun 10, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/0645
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of producing sealed cavity structures in the surface layer of a selectively etchable substrate (1), comprises: a) depositing a masking layer (2) of etchable material on the substrate (1), b) by means of etching, opening at least one hole (3) in the masking layer (2) down to the substrate surface, c) through said hole or holes (3) in the masking layer (2) selectively etching the substrate (1) in under the masking layer (2) so as to form one more cavities (4) which extend under the masking layer, and d) sealing said hole or holes (3) in the masking layer (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.