Method of processing a semiconductor chip package
US5690877A · kind A · utility
0Cited by
13References
14Claims
0Family size
Inventors
Key dates
| Filing date | Mar 16, 1995 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Mar 16, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of removing dam bars (15) from leads (17) of a semiconductor chip package (10) is performed by first breaking a bond between the dam bars (15) and excess mold compound (12) from a mold compound (11). The bond is broken by slight movement of the dam bar (15). Thereafter, the dam bar (15) is completely removed by moving the dam bar (15) further, without causing chips or cracks in the mold compound (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.