Solder
US5690890A · kind A · utility
11Cited by
0References
1Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 4, 1994 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Nov 4, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.