Polymeric compositions with high self-adhesion and packaging materials and packages made therefrom
US5691052A · kind A · utility
37Cited by
34References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2878
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a polymeric composition which acts as an improved cold seal mechanism over prior art cold seal structures. The composition comprises a blend of 40% to 80% by weight of a tacky adhesive and 60% to 20% by weight of a lower viscosity, non-tacky resin. The composition has a seal strength of at least 0.2 lbs per inch when sealed to itself at a temperature of less than 120.degree. F., and can be formed into a film for subsequent use in packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.