Methods of forming two-sided HDMI interconnect structures
US5691245A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1996 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Oct 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of forming two-sided high density multilayer interconnect (HDMI) structures on a relatively large carrier and subsequently releasing and removing one or more structures to provide useable flexible interconnects or decals. In general, a carrier is provided and a release layer is formed on the carrier. Flexible high density multilayer interconnect structures are fabricated on the release layer. The release layer is processed to release and remove one or more flexible HDMI structures from the carrier. The carrier may be an ultraviolet transparent substrate, such as quartz, for example, and the release layer may be a polyimide layer. The HDMI structures are released by irradiating the release layer through the transparent carrier using ultraviolet radiation from an ultraviolet radiation source. Alternatively, a silicon carrier may be used that has a metal or silicon dioxide release layer formed thereon. The HDMI structures are released from the metal or silicon dioxide release layer by using wet etching procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.