Microchannel cooling using aviation fuels for airborne electronics
US5692558A · kind A · utility
95Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1996 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Jul 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Aviation fuel is used as the coolant for a microchannel heat sink for airborne electronics. The use of preexisting aviation fuel as a coolant medium eliminates the weight, size and expense of a separate liquid system dedicated solely to electronics cooling. The heat sink is comprised of a body of material having high thermal conductivity and in which are formed a set of parallel closed-ended microchannels on the order of 0.001 in. by 0.004 in. separated by a distance of 0.001 in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.