Method for sealedly forming envelope
US5693111A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1995 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Jul 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.