Corrugated board manufacture
US5693167A · kind A · utility
8Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1025
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Method and apparatus for manufacturing corrugated board comprising two layers of corrugated medium joined together in tip-to-tip registration of the two mediums, without an intermediate liner, and with at least one outer liner. Adhesive is applied to the tips of the two mediums, and the tips are brought together and held in contact with each other while the adhesive sets at least partially during conveyance of the mediums along a linear path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.