Process for metallization of a nonconductor surface

US5693209A · kind A · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Burkhard Bressel · Berlin, DE
• Heinrich Meyer · Berlin, DE
• Walter Meyer · Sparks, US
• Klaus Gedrat · Berlin, DE

Key dates

• Filing date: Aug 23, 1995
• Grant date: Dec 2, 1997
• Expiry date: Aug 23, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S205/92
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.