Separately etching insulating layer for contacts within array and for peripheral pads
US5693567A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of producing a product such as an x-ray sensor array performs two etching operations on an insulating layer to expose different parts of a conductive layer. One etch exposes part of the conductive layer in each unit of cell circuitry in the array without exposing the contact pads at the array's periphery. Then, a conductive layer including ITO is deposited over the insulating layer and patterned to form a conductive element for each unit, with the conductive element contacting the exposed part of the conductive layer. Afterward, a second etch exposes contact pads at the periphery of the array. As a result, the contact pads have high quality surfaces, facilitating testing and wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.