Buffer of fine connection structure for connecting an atom level circuit and a general semiconductor circuit
US5694059A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1995 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Feb 6, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/937
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A buffer circuit ID provided for connecting an atom level device (for example, an Atom Relay Transistor circuit), formed by arranging atoms in a predetermined pattern, to a device such as a semiconductor device and a quantum device. The buffer circuit can be formed as a voltage or current amplification circuit. The voltage amplification circuit may be a single electron transistor circuit, and the current amplification circuit may be an avalanche amplification device circuit. The Atom Relay Transistor circuit and the device such as a semiconductor device and a quantum device are formed substantially on the same flat insulating member, and connected by a fine connection structure made of a conductive body such as metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.