Integrated circuit mounting structure including a switching power supply
US5694297A · kind A · utility
41Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1995 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Sep 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting structure for providing DC power to an IC package is disclosed. The mounting structure comprises a socket for receiving an IC package, having one or more IC chips, and a power supply for supplying at least one specified DC voltage to the IC package. The power supply is coupled to the IC package by conductive paths formed in the socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.