Micromachined device packaged to reduce stiction
US5694740A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1996 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Mar 15, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromachined device is packaged to reduce stiction. In one embodiment, a level of moisture is introduced in the package to create a very thin film over surfaces of the device. The device can also be packaged with a vapor deposition of an organic material after a wafer of devices has been separated into individual dies and the individual dies are placed in open containers. In another embodiment, a micromachined device is positioned in an open package and a liquid or solid organic material is disposed within the package so that when the device is sealed, the organic material vaporizes and coats portions of the die to reduce stiction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.