Cleaning agent and method for cleaning semiconductor wafers

US5695572A · kind A · utility

Assignee

• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Roland Brunner · Wien, AT
• Georg Hochgesang · Burghausen, DE
• Anton Schnegg · Burghausen, DE
• Gertraud Thalhammer · Burghausen, DE

Key dates

• Filing date: Aug 10, 1995
• Grant date: Dec 9, 1997
• Expiry date: Aug 10, 2015

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D3/3472
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A cleaning agent and method are useful for cleaning semiconductor wafers. The aqueous cleaning agent has a pH of 1 to 5, preferably a pH of 1 to 3, and contains at least one surfactant and at least one compound which belongs to a group of compounds comprising succinic acid and its derivatives. To clean the semiconductor wafers, a thin film of cleaning agent is generated on the side faces of the semiconductor wafers, preferably using a mechanical tool.