Method of centering a high pressure lid seal
US5695593A · kind A · utility
0Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1995 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Oct 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lid is sealed to an integrated circuit package by a method that uses a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The pressure foot is retracted against the spring bias while secondary jig index pins are meshed with corresponding sockets in the fabrication boat that are aligned with the package position on the boat. When the pins and sockets are meshed, the pressure foot is released to apply optimal assembly force at the package center normal of the package lid plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.