Patent · US Expired

Thermally conductive, electrically insulating glued connection, method for the production thereof and employment thereof

US5695872A · kind A · utility

3Cited by

4References

7Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Karl-Heinz Ideler · Spardorf, DE
Dieter Dlugosch · Heilsbronn, DE
Winfried Arz · Koblenzer Straße, DE

Key dates

Filing date	Jan 12, 1995
Grant date	Dec 9, 1997
Priority date	—
Expiry date	Jan 12, 2015

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/259
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A glued connection suitable for attaching high power electronic components to a mounting location, such as on a cooling element, has an electrically insulating base layer of unfilled adhesive applied onto at least one surface of the parts to be glued. An adhesive filled with an electrically insulating powder that has good thermal conductivity is applied onto at least one part surface. Grains of the powder puncture the base layer, and the thickness of the glued connection thus essentially corresponds to the size of the grains.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.