Particle board and use thereof
US5695875A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1995 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Mar 20, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31989
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A particle board including wood particles having a maximum particle size of 3 mm and an average particle size of between 0.2 mm and 2.0 mm. The wood particles are combined with a glue, present in a concentration of 5% to 18% by weight, and 0.1% to 1% by weight of a sizing agent. The particle board components are subjected to a pressure of 15 to 50 kp/cm.sup.2 and a temperature of 120.degree. to 210.degree. C. to produce a particle board having a density of 600 to 1200 kg/m.sup.3 and a water absorption of 14% to 30% by weight, said swelling and absorption measured after 24 hours in water, a bending strength of 18 to 35 MPa and an internal bond strength of 1.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.