Process for manufacturing a lead frame
US5696029A · kind A · utility
12Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 1996 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | May 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame design and manufacturing process comprising a lead frame (18) having its internal lead fingers (20) punched out to dimensions optimized to accommodate the body size of a selected die. A die pad (30), also optimized to accommodate the body size of the selected die, is attached to the lead frame with mechanical or chemical bonding. Punches are used to punch out the internal lead pins according to selected dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.