Tape application platform and processes therefor
US5696032A · kind A · utility
Inventors
Key dates
| Filing date | Dec 30, 1996 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Dec 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated-circuit manufacturing process uses a platform to carry an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, to provide interconnections, and to support the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.