Method and apparatus for separating a thin film from a substrate
US5696327A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1994 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Nov 23, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for separating a thin film from a substrate, the thin film having a surface with a selected width, includes an indenter for applying a force to the surface of the thin film that is substantially equal along the selected width. The forces are applied until separation of a portion of the thin film from the substrate occurs. In a preferred embodiment, the indenter is made from a block of material having a substantially flat surface engageable with the surface of the thin film. The substantially flat surface of the block of material has a width at least equal to the width of the surface of the thin film. Based on the two dimensional geometry of the mechanics, accurate analysis of work of adhesion is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.