Microelectronic package with device cooling
US5696405A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 13, 1995 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Oct 13, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronics package has improved device cooling. The package includes a lead frame defining an upper and lower surface. An active electronic device, such as an integrated circuit, is positioned above the upper surface of the lead frame. An encapsulating package is molded around both the lead frame and the active electronic device to form the microelectronic package. A cooling tube is integrally molded within the encapsulating package and typically formed of a thermally conductive material such as copper. A cooling fluid, such as air or a liquid, can be moved through the cooling tube for discharging the heat generated by the active electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.