Basepan with integrally formed posts for mounting components by heat staking
US5696664A · kind A · utility
10Cited by
28References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 1996 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Mar 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02B1/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A basepan for an electric load center having a surface with integrally formed posts with an undercut extending around its periphery for securing a component of the load center to the surface by heat staking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.