Integrated circuit package with diamond heat sink
US5696665A · kind A · utility
37Cited by
4References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 22, 1996 |
| Grant date | Dec 9, 1997 |
| Priority date | — |
| Expiry date | Apr 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond or diamond-coated silicon carbide or molybdenum, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate. The thermal connection can be by bonding the pins directly to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.