Method of producing a head for the printer
US5697144A · kind A · utility
78Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1995 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Jul 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
To provide a method of fabricating, using thin-film processes only, a 1,600 dpi head with nozzles arranged two-dimensionally on a substrate, e.g., silicon wafer, a drive LSI, thin-film resistors and thin-film conductors are formed on the silicon wafer. Thereafter, ink channels and through-holes are formed by silicon anisotropic etching from both sides of the silicon wafer. After connecting the orifice plate to the silicon wafer, nozzles are formed in the orifice plate using photoetching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.