Plating bath and method for electroplating tin and/or lead
US5698087A · kind A · utility
22Cited by
12References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 1992 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Mar 11, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
It now has been found that a smooth and level deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (B) an acid selected from the group consisting of sulfuric or fluoboric acid; and (C) an effective amount of at least one soluble bismuth salt of an alkane sulfonic acid or an alkanol sulfonic acid. Optionally, the aqueous plating bath may further comprise (D) at least one surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.