Resin tablet for sealing semiconductor
US5698152A · kind A · utility
12Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1996 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Oct 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/8305
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.