Method of producing a resist pattern by contact imaging a photoimageable composition providing a tack-free surface
US5698376A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1996 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Mar 20, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2810/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In a method of providing a resist pattern on a substrate surface, a layer of photoimageable composition is applied to a substrate, which photoimageable composition provides a tack-free surface. The photoimageable composition comprises: A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoinitiator chemical system (the weight percentages are based on the total weight of components A)-C)). The binder polymer A) comprises a backbone formed of between about 45 and about 65 mole percent of monomers which are selected from the group i) consisting of styrene, C.sub.1 14 C.sub.6 -substituted styrene and mixtures thereof and between about 35 and about 55 mole percent of monomers which are selected from the group ii) consisting of maleic anhydride, alkyl-substituted maleic anhydride, aromatic-substituted maleic anhydride and mixtures thereof. Monomers of group ii) provide anhydride groups to the backbone of the polymer. The anhydride groups are mono-esterified to between about 50 and ab…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.