Epoxy resin compositions for encapsulating signal transmission devices
US5698631A · kind A · utility
20Cited by
20References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1996 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | May 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2938
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A room-temperature curable composition useful for encapsulating transmission signal devices, comprising: (1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more; (2) an epoxy-functional compound having an epoxy functionality of 2 or more; and (3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds. The composition is useful for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.