Semiconductor apparatus with a multiple element electrode structure
US5698898A · kind A · utility
12Cited by
0References
12Claims
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Assignee
Inventor
Key dates
| Filing date | May 21, 1996 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | May 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bolt (42a) is connected to a copper plate (9a) by a first electrode (51a), a second electrode (52a) and a wire (10a) for connecting the first and second electrodes. Similarly, a bolt (42b) is connected to a copper plate (9b) by a first electrode (51b), a second electrode (52b) and a wire (10b) for connecting the first and second electrodes. The wires (10a, 10b) are flexible and made of aluminum, for example. Electrical connection can be kept and the upper bound of absorption of the stress applied between the bolts (42a, 42b) and the copper plates (9a, 9b) can be increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.